1. 2. 3. material content data sheet sales product name bss214n h6327 issued 29. august 2013 ma# MA000938692 package pg-sot23-3-5 weight* 9.36 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.008 0.09 857 non noble metal tin 7440-31-5 0.002 0.02 221 inorganic material silicon 7440-21-3 0.122 1.31 1.42 13070 14148 leadframe non noble metal chromium 7440-47-3 0.009 0.10 966 inorganic material silicon 7440-21-3 0.001 0.01 64 non noble metal titanium 7440-32-6 0.003 0.03 322 non noble metal copper 7440-50-8 3.000 32.06 32.20 320572 321924 wire non noble metal copper 7440-50-8 0.044 0.47 0.47 4741 4741 encapsulation organic material carbon black 1333-86-4 0.057 0.61 6128 plastics epoxy resin - 1.233 13.18 131754 inorganic material silicondioxide 60676-86-0 4.445 47.48 61.27 474929 612811 leadfinish non noble metal tin 7440-31-5 0.150 1.60 1.60 15988 15988 plating noble metal silver 7440-22-4 0.284 3.04 3.04 30388 30388 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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